Press Releases

Ten Leading Communications Companies Join Forces To Develop Industry's Smallest 10-Gigabit Module

Ultra Small, 10-Gigabit Module Slashes Cost, Power and Footprint of Telecommunications and Datacommunications Equipment

NEWS RELEASE
Contact:
Shriraj Gaglani
949-981-4921
sgaglani@broadcom.com

IRVINE, Calif. - March 4, 2002 - Ten leading communications companies today announced the formation of a 10-Gigabit Serial Interface Module Group (XFP). The purpose of the group is to develop a common specification for multi-sourcing application-agnostic, ultra-small form factor, 10 Gigabit per second (Gb/s) modules. These modules will occupy one-fifth the space and use one-half the power of current modules. They will also be hot-pluggable, support data rates from 9.95 Gb/s to 10.7 Gb/s, and are targeted for applications up to 40km.

The XFP group brings together leading networking, system, optical module, semiconductor and connector companies from both the telecommunications and datacommunications markets. Founding member companies include Broadcom Corporation, Brocade, Emulex Corporation, Finisar, JDS Uniphase, Maxim Integrated Products, ONI Systems, ICS (a Sumitomo Electric company), Tyco Electronics and Velio.

XFP Modules feature a serial 10 Gb/s electrical interface called XFI. This interface technology removes the complexity and power associated with placing electrical transceivers inside today's modules, resulting in significant space, power and cost savings to module manufacturers. XFI technology is powered by production proven devices developed by Broadcom.

"XFP is an exciting standard because it provides a roadmap for cost reduction of 10 Gb/s optical interconnect," said Allan Armstrong, Director of Optical Transport Semiconductors at RHK. "Placing the PHY on the board avoids the double markup of the IC and enables integration of the Layer 2 device with the PHY. The economics of XFP Modules will bring significant cost relief to Optical Transport equipment, which make up 95 percent of 10G links today".

"The XFP group has made significant progress towards defining the technology and specification for the next generation of 10 Gb/s modules in a relatively short amount of time. Our goal is to develop a preliminary specification by the second quarter of this year," said Bob Snively, Principal Scientist, Brocade, and Chairman of the group.

The small size of XFP modules will enable the development of sixteen 10-Gigabit ports to be deployed on a 22-inch line card in telecom equipment while their cost structure will accelerate the deployment of inexpensive 10 Gigabit client interfaces in data communication equipment. Because the XFP specification is not protocol dependent, multiple market segments will benefit from the aggregate volume of XFP modules

"The development of the XFP module promises to enable cost-effective, high- performance storage networking products," said Ron Quagliara, Emulex Chief Technology Officer. "As the world's leading storage networking host bus adapter supplier, Emulex is committed to driving and delivering world-class products and solutions for the SAN space."

XFP prototype modules using XFI technology will be demonstrated for the first time at the Optical Fiber Conference in Anaheim, California from March 19-21, 2002

For more information about the XFP Group, please visit www.xfpmsa.org

"XFI technology is a quantum leap in the evolution to 10 Gb/s serial interconnects. The combination of a CMOS FEC/Framer/MAC with an integrated serial 10 Gb/s PHY and XFP modules will have an immediate impact on lowering the cost and increasing the density of DWDM Transport Equipment," said Ali Ghiasi, Principal Scientist at Broadcom.

"Finisar believes that serial modules offer the highest density, lowest power and lowest cost solution for 10Gb/s applications," said Lew Aronson, Chief Scientist at Finisar

"JDS Uniphase believes XFP's multi-protocol support combined with high port density promises a lower overall system cost to our customers," said Dennis Karst, General Manager of the JDS Uniphase Datacom Products Business Unit.

"The XFP technology offers an application-independent solution for 10G fiber optic modules. This will allow for cost-effective system implementation," said Quentin Tan, Senior Member of Technical Staff at Maxim Integrated Products.

"TycoElectronics is pleased to be working with industry leaders and OEMs to design the high speed interconnects, shielding enclosures and heat dissipation products for the new XFP specification," said Bob Atkinson, Business Development Manager at Tyco Electronics.

Safe Harbor Statement of the XFP MSA Group under the Private Securities Litigation Reform Act of 1995:

This release may contain forward-looking statements based on our current expectations, estimates and projections about our industry and certain assumptions made by us. Words such as "anticipates," "expects," "intends," "plans," "believes," "seeks," "estimates," "may," "will" and variations of these words or similar expressions are intended to identify forward-looking statements. In addition, any statements that refer to expectations, projections or other characterizations of future events or circumstances, including any underlying assumptions, are forward-looking statements. These statements speak only as of the date hereof, and are based upon the information available to us at this time. Such information is subject to change, and we will not necessarily inform you of such changes. These statements are not guarantees of future performance and are subject to risks, uncertainties and assumptions that are difficult to predict. Therefore, our actual results could differ materially and adversely from those expressed in any forward-looking statements as a result of various factors.

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